Half-etching of the lead frame provides mold compound locking features for the perimeter pads and die thermal paddle (see Figure 4). LFCSP Outline Drawing (JEDEC MO-220)ĪDI packages are punched or sawed from a molded strip during final assembly. The detailed package outline of the LFCSP is shown in Figure 3.įigure 3. It allows higher density PCB application than the corresponding leaded package style. The LFCSP is ideally suited to hand-held mobile application or any application where weight and size is an issue. Packaging is in tape and reel or trays.įigure 1. Perimeter and thermal pad finish is plated as Sn/Pb solder or 100% Sn. Wire bonding is provided using gold wires (see Figure 2). Stable electrical ground connections are provided through down bonds and through conductive die attach material. Heat is efficiently conducted from the package by soldering the exposed thermal paddle (see Figure 1) to the PCB. Electrical contact to the printed circuit board (PCB) is made by soldering the perimeter pads and exposed paddle on the bottom surface of the package to the PCB. Perimeter input/output pads are located on the outside edges of the package. The LFCSP is a near chip scale package (CSP), a plastic encapsulated wire bond package with a copper lead frame substrate in a leadless package format. The LFCSP is compliant with JEDEC MO220 and MO229 outlines. This application note provides design and manufacturing guidance in the use of the lead frame chip scale package (LFCSP). AN-772: A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP)
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